Apple iPhone 6S/iPhone 6S Plus BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation
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Informations complémentaires
| Type de produit | BGA Chip Ball Template Stencil |
|---|---|
| Groupe produits | Outils |
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