● High-quality steel sheet stencil, more durable
● Precise laser cutting for better alignment
● High-temperature resistance, not easy to get deformed
● The CPU and the common fault ICs are integrated into one stencil
● IC numbers are lasered on the stencil for reference, much easier to find
MaAnt BGA Reballing Stencils For Samsung (S/Note/A Series)
44,95 €
Rupture de stock
Informations complémentaires
| Type de produit | BGA Chip Ball Template Stencil |
|---|---|
| Groupe produits | Outils |
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