Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation – For iPhone 13 / 13 Mini / 13 Pro / 13 Pro Max
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Informations complémentaires
| Label Qualité | OEM Complet |
|---|---|
| Type de produit | BGA Chip Ball Template Stencil |
| Groupe produits | Outils |
| Champ supplémentaire | For iPhone 13/13 Mini/13 Pro/13 Pro Max |
Brand
Apple
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